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​n-unixx-SERIES

Semi-Automatic Systems for Lab Applications

Spin & spray coater, developer, temperature and smartEBR modules are available as stand-alone or bench mounted configurations.

Round wafer up to Ø300 mm (Ø12 inch)​

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Base frame design allows various process modules configurations.

Square substrate size up to 230 x 230 mm (9 x 9 inch)

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SPIN COATER

Spin coating with Covered Chuck Processor (CCP) or open bowl

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SPRAY COATER

Spray coating for all topographies and shapes

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HOTPLATES

Softbake (pre-bake), hardbake, HMDS: vapor priming, vacuum drying, coolplates

Main Features
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