Semiconductors
Plasma assisted etch and deposition solutions for the fabrication of devices in a wide range of material systems.
Heidelberg Instruments offers tools that are suited for fabrication of flexible chips, contact layers and metalized line on CMOS master, multi-layer device production for semiconductor packaging, critical processes during the fabrication of semiconductor-based devices, from reticles demanding high precision and high uniformity to high-throughput maskless exposures with adaptive patterning.
There is a need to analyze composite semiconductors regarding their chemical composition by XPS, their band structure or band positions with ARPES or UPS and regarding film and surface qualities and properties by SPM and LEEM or PEEM.
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Printing of resists
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Deposition of sensor active inks
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Chip packaging
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Printing of dielectrics, conductives, and adhesives
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Printing of resists
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Deposition of sensor active inks
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Chip packaging
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Printing of dielectrics, conductives, and adhesives
When plasma is used to functionalize a surface prior to bonding, the resulting optimized bonds will display a strong adhesion improvement. Plasma can be used on a wide variety of materials: metals, glass, ceramics, and even natural materials such as woods and textiles respond very well to plasma functionalization. The atmospheric pressure of our plasma systems is generated using air or typical industrial gases such as hydrogen, nitrogen or oxygen.