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n-varixx-SERIES

Automatic Combined Cluster Systems

Flexible configuration of processing modules

Round wafer up to Ø300 mm (Ø12 inch)

Square substrates size up to 230 x 230 mm (9 x 9 inch)

Handling thin, standard or bonded wafer (Si, glass & others)

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Optional sub-systems; wafer flipper, PR dispense system (pumps, syringe, CPD) and media supply cabinets with various canister designs.

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SPIN COATER

Spin coating with Covered Chuck Processor (CCP) or open bowl

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SPRAY COATER

Spray coating for all topographies and shapes

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HOTPLATES

Softbake (pre-bake), hardbake, HMDS: vapor priming, vacuum drying, coolplates

Main Features
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