Micro-Electro-
Mechanical Systems
MEMS
MEMS and MOEMS have various applications including accelerometers, gyroscopes, pressure sensors, biosensors, micropumps, microvalves, and in optical switches, optical modulators, and optical interconnects. 
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Heidelberg Instruments’ DWL and MLA series of Direct Write Laser Lithography tools can be used to create etch masks on silicon, high aspect ratio structures in thick photoresists such as AZ 125 and SU-8, and material deposition in cleared resist patterns.
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MPO 100 system offers the capability to manufacture microstructures directly in polymer materials, allowing for the creation of intricate 3D micro-mechanisms or the connection of two optical elements.
Micro/Nano Electro Mechanical Systems (M/NEMS) and Sensors have become well established with multiple devices being used in consumer and commercial products. This includes smartphones, automotive, games consoles, navigation aids, drones, and biomedical devices. This is set to increase as the Internet of Things (IoT) matures beyond its current capabilities.
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BENEFITS IN THE MEMS & SENSORS APPLICATION including Exceptional Miniaturization, Complex Geometries and Structures, Enhanced Performance, Rapid Prototyping and Development: 
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CAPABILITIES OF DALP™ TECHNOLOGY in High-Resolution Layering, Material Versatility, Customization and Adaptability, Integration with Current Technologies
3D imaging of reflective (e.g. silicon) and transparent (e.g. glass, PDMS) substrates from any angle.