Packaging

Device packaging refers to the final stage of fabrication, where the chip (or die) is encased in a protective shell to safeguard it from physical damage and environmental factors. This process also facilitates the electrical connections between the semiconductor and the external circuitry:

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• Die Bonder

• Wire Bonder

• Inert Glove Box

• Cleanroom/ Tent

• Wafer Dicer

• Wafer Polisher

• Wafer Grinder

• Solder Reflow 

• MEMS Packaging