As miniaturization advances, chips are now often bonded directly to glass (Chip-On-Glass), using anisotropic conductive foils or pastes. These materials operate differently from traditional adhesives or solder, requiring unique processing methods.
In this white paper discover how Bonding with Anisotropic Conductive Adhesive works:
➡️the technology,
➡️the challenges,
➡️the proven solutions.
👇 Link to download
For more information contact us today!
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