Die Bonders
Die bonders provide accurate placement and secure attachment of semiconductor dies onto substrates or packages. Designed for high-speed, repeatable operation, they deliver precise alignment, controlled bonding force, and reliable thermal performance for advanced electronic and quantum-device manufacturing.
High-precision die placement
Fast and repeatable bonding process
Advanced vision alignment system
Stable thermal and force control
Low contact resistance performance
Product segments
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R&D Bonders
R&D bonders provide flexible, high-precision die placement and bonding for semiconductor research, prototyping, and process development. They support controlled alignment, force, temperature, and dispensing parameters, making it easier to test new materials, packaging methods, and device concepts.
Production Bonders
Production bonders are designed for high-volume semiconductor manufacturing, delivering fast, accurate, and repeatable die placement. They combine automated handling, precise alignment, and reliable process control to maintain consistent quality, reduce downtime, and improve production efficiency.
Nano Vacuum delivers world-leading vacuum, micro and nano-fabrication, and quantum-cryogenic solutions for researchers and innovators across Australia and New Zealand.
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Phone
1800 560 820
Location
6 / 7 Salisbury Road, Castle Hill, NSW. 2154
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