VPG 300 DI Maskless Stepper
Stepper-Level Performance with Unmatched Flexibility for R&D, Prototyping, and Microfabrication
Break free from the constraints, costs, and delays of photomasks. The VPG 300 DI is a high-performance direct write lithography system designed to accelerate your innovation cycle from weeks to hours. By combining the precision of a traditional i-line stepper with the powerful advantages of a maskless workflow, the VPG 300 DI empowers researchers and engineers to pattern high-resolution microstructures directly onto wafers up to 300 mm with unparalleled speed and flexibility.
The Power of a Stepper, The Freedom of Direct Write
The VPG 300 DI closes the gap between R&D and production. It provides the sub-micron resolution and tight overlay accuracy you expect from a mask-based stepper, while eliminating the significant expenses and lead times associated with mask procurement. This makes it the ideal solution for rapid prototyping, process development, and applications requiring frequent design iterations.
From CAD to Exposure in Minutes, Not Weeks
Instantly transfer your design to the substrate and iterate at the speed of thought. The VPG 300 DI’s advanced optical engine allows you to test new designs daily, not monthly, dramatically accelerating your development timeline.
High-Speed Exposure: A custom spatial light modulator (SLM) and optimized data path enable you to write a 100×100 mm2 area in just 9 minutes.
Stitching-Free Large Areas: Create large-area devices or dies of virtually unlimited size without the stitching errors inherent to steppers.
Instant Design Changes: Modify your CAD file and begin exposing immediately. No need to order, wait for, inspect, and store a new mask.
Achieve Exceptional Feature Fidelity
Your research demands precision. Built upon our field-proven VPG+ platform with a high-stability Zerodur® stage, the VPG 300 DI delivers outstanding quality for your most demanding microstructures.
High-Speed Exposure: A custom spatial light modulator (SLM) and optimized data path enable you to write a 100×100 mm2 area in just 9 minutes.
Stitching-Free Large Areas: Create large-area devices or dies of virtually unlimited size without the stitching errors inherent to steppers.
Instant Design Changes: Modify your CAD file and begin exposing immediately. No need to order, wait for, inspect, and store a new mask.
Intelligent Tools for Complex Device Fabrication
From multi-layer MEMS to advanced packaging, the VPG 300 DI is equipped with sophisticated systems to ensure perfect alignment and focus across the entire substrate.
Automated Multi-Layer Alignment: Achieve topside alignment accuracy down to 100 nm. The system also supports automated VIS and IR backside alignment for buried structures.
Dynamic Autofocus: A choice of optical or pneumatic autofocus systems dynamically compensates for wafer warpage or topography variations > 160 µm, ensuring sharp focus everywhere.
Integrated Metrology: Perform on-the-fly measurements of position, CD, and edge roughness directly within the tool, providing immediate process feedback.
Environmental Stability: An integrated flowbox and ambient condition sensors with software compensation ensure stable and repeatable writing results day after day.
Customer applications
VPG 300 DI High NA mode: Grid of round 500 nm features with a high density in IP resist. Demonstration of resolution abilities.
Photonic splitter pattern in positive resist. Reduced writing grid was applied for smooth interpolated roundings and sharp edges.
8-level quartz Diffractive Optical Element (DOE). The pixels are about 2 μm in size, the array of devices covers an area of about 20 mm. (Courtesy of IMS Chips)
Why customers choose our systems
"The VPG allows us to realize copper lines and chip-to-chip interconnects with a size down to 1 µm, which is three times smaller in feature size than when using the conventional mask aligner process."
Markus Wöhrmann, Group leader Lithography and Thin Film Polymers for Wafer Level Packaging
Fraunhofer Institute for Microintegration and Reliability,Berlin, Germany
Technical Data
Write mode(Writing performance) | I | II |
|---|---|---|
Minimum feature size [µm] | 0.5 | 0.8 |
Minimum lines and spaces [µm] | 0.8 | 1.2 |
Address Grid [nm] | 4 | 8 |
Edge roughness [3σ, nm] | 30 | 40 |
CD uniformity [3σ, nm] | 50 | 60 |
2nd layer alignment (global) [nm] | 100 | 130 |
Write speed [mm2/min] | 340* | 1020* |
Exposure time for 100 x 100 mm2 area [min] | 39 | 17 |
*Fast mode: 680 and 2056 mm2/min with similar performance, but without specification
System features | -- |
|---|---|
Light source | High-power DPSS laser with 355 nm |
Maximum substrate size and write area | 300 x 300 mm2 |
Substrate thickness | 0 to 12 mm (other thicknesses on request) |
Maximum exposure area | 300 x 300 mm2 |
Autofocus | Realtime autofocus system (optical and pneumatic) |
Autofocus compensation range | > 160 µm |
Flowbox | (Closed-loop) temperature controlled environmental chamber |
Alignment and metrology | Camera system and software package for metrology and alignment |
Other features and options | Full automatic handling and prealigning of 100, 150, 200, and 300 mm wafers. Optical edge detection, topside alignment and optional IR and backside alignment. Zerodur® stage and high-resolution differential interferometer |
System dimensions | System / Electronic rack |
|---|---|
Width [mm] | 2605 / 800 |
Depth [mm] | 1652 / 650 |
Height [mm] | 2102 / 1800 |
Weight [kg] | 3550 / 180 |
Installation requirements | - |
|---|---|
Electrical | 400 VAC ± 5 %, 50/60 Hz, 16 A, 3 phases |
Compressed air | 6 - 10 bar |
