ULTRA Semiconductor Mask Writer
Stepper-Level Performance with Unmatched Flexibility for R&D, Prototyping, and Microfabrication
In the competitive landscape of mature semiconductor fabrication, you face a critical challenge: how to increase throughput and maintain exceptional quality without escalating costs. The ULTRA laser mask writer is engineered to solve this exact problem. It provides a powerful, cost-effective solution for producing photomasks for microcontrollers, power management ICs, LEDs, IoT devices, photonics, and MEMS, delivering the speed, precision, and reliability you need to maximize your yield and profitability.
Superior Image Quality and Seamless Integration
Produce flawless photomasks with feature fidelity that meets the strictest standards. The ULTRA’s custom optics deliver sharp, well-defined structures down to 500 nm. Its thoughtful design ensures it fits effortlessly into your existing facility.
Custom High-NA Optics: Our custom-designed write lens and low-distortion UV optics guarantee exceptional image quality and structure uniformity.
Compact Footprint: The system is engineered to occupy minimal cleanroom space, allowing for easy integration into an existing mask shop infrastructure without costly renovations.
Proven Reliability: The ULTRA is a qualified, industry-tested platform trusted by leading photomask shops worldwide.
Achieve Maximum Yield with Uncompromising Precision
Every nanometer counts. The ULTRA is built on a foundation of high-precision components to ensure superior overlay, registration, and Critical Dimension (CD) uniformity, mask after mask.
High-Precision Stage System: A full air-bearing stage and a zero thermal expansion ZERODUR® chuck provide ultimate stability and eliminate thermal drift.
Advanced Position Control: A high-resolution differential interferometer system ensures extremely accurate and repeatable feature placement.
Tool Matching Functions: On-board correction capabilities allow you to precisely match the output of multiple machines, ensuring consistency across your entire mask set.
Accelerate Your Production with High Throughput
Minimize tool downtime and meet demanding production schedules with productivity that surpasses legacy tools. The ULTRA’s advanced exposure engine and optimized write modes dramatically reduce mask writing times, enabling you to produce a standard 6” photomask in less than 45 minutes.
Fast SLM-based Exposure Engine: Delivers write speeds up to 580 mm²/minute without compromising quality.
Full Automatic Mask Handling: Reduces operator overhead with a simple, easy-to-use mask loading interface and ensures consistent, repeatable loading and unloading for continuous operation.
Optimized Write Modes: Provides the flexibility to prioritize speed or resolution to match your specific job requirements.
Why Choose the ULTRA?
The ULTRA integrates state-of-the-art technology to address the primary concerns of modern mask shops: speed, accuracy, and return on investment.
Customer applications
The ULTRA’s data path has been designed to be able to handle even complex geometries and dense patterns while upholding high exposure speed – even round or circular features can be written easily. The image shows circles (Ø 5 µm) etched in chrome with a line width of 600 nm.
This optical microscope image shows a structure etched in chrome with a line width of 700 nm.
Regular structure showing unifomity etched in chrome (line width 1 μm). Optical microscope image with a top illumination.
Technical Data
Writing performance | QX mode | FX mode |
|---|---|---|
Address grid [nm] | 4 | 10 |
Line edge roughness [3σ, nm] | 20 | 40 |
Position accuracy [3σ, nm] | 40 | 80 |
Overlay [3σ, nm] | 30 | 60 |
Stitching [3σ, nm] | 20 | 60 |
2nd layer alignment [max error / nm] | 100 | 100 |
CD uniformity [3σ, nm] | 30 | 60 |
Minimum feature size [nm] | 500 | 700 |
Write speed [mm² / min] | 325 | 580 |
Write time for 6″ x 6″ [min] | 75 | 45 |
Operation | -- |
|---|---|
User interface (software) | SEMI-compliant GUI |
Maximum write area | 228 x 228 mm² (others on request) |
Substrate size | 4", 5", 6", 7", and 9" masks (larger and other substrates on request) |
System features | -- |
|---|---|
Laser | High power diode pumped solid state laser with 355nm wavelength |
Focus system | Real-time optical autofocus |
Alignment | Camera system
Distortion compensation
Global and Field-by-field alignment
Edge detector |
Data path Real-time compression | Scalable hardware concept
Input formats: All standard formats, e.g. GDSII and Jobdeck |
Spatial Light Modulator | Frequency 350 kHz
Data rate 2.4 GB/s |
Automation | Full automatic mask handling with two carrier stations up to 9“; optional SECS/GEM protocols |
Optics | 0.9 NA objective lens
Low-distortion UV optics
Automatic calibration routines |
System dimensions | System / Electronic rack |
|---|---|
Width [mm] | 2995 / 800 |
Depth [mm] | 1652 / 650 |
Height [mm] | 2102 / 1800 |
Weight [kg] | 3400 / 180 |
Installation requirements | -- |
|---|---|
Electrical | 400 VAC ± 5%, 50/60 Hz, 16A, 3 phases |
Compressed air | 7 - 10 bar (without oil or other residue) |
